semiconductor chip

semiconductor chip

美 　英

• un.半导体芯片器件；半导体片状器件
• 网络半导体晶片；半导体基片

英汉解释

un.	1. 半导体芯片器件 2. 半导体片状器件

例句

At least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.

至少一个半导体芯片（例如麦克风芯片）安装在基座部上并且在屏蔽板的正上方。

The invention discloses a semiconductor structure including ad aisy chain adjacent to an edge of a semiconductor chip.

本发明公开一种半导体结构，包括与半导体芯片的边缘相邻的串状链。

intel is a semiconductor chip maker , developing integrated technology platforms for computing and communications.

英特尔是一家半导体芯片制造商，主要开发面向计算和通信领域的集成技术平台。

A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided.

本发明提供一种用于制造被集成于半导体芯片中的螺线管电感器的手段。

and second reflector formed on circuit board surface at the semiconductor chip side and reflecting preset test light.

和第二反射器，形成于在电路板侧上的半导体芯片的表面上并反射预定的测试光。

Long triangle area is the core of industry of Chinese semiconductor chip, assemble is numerous international lead firm.

长三角地域是中国半导体芯片工业的核心，集聚众多国际超前厂商。

PROMOTING "THE FUNDAMENTAL RESEARCH OF INTEGRATED SYSTEM ON-A-SEMICONDUCTOR-CHIP"

大力支持“半导体集成化芯片系统的基础研究”

In this thesis, we will design planar antenna and semiconductor chip antenna, of the wireless communication.

在本论文中，我们将设计平板天线与半导体晶片天线，以便应用在无线通讯的机构中。

Although industry of Chinese semiconductor chip develops rapid, but crop takes the whole world only 6% the left and right sides.

中国半导体芯片工业虽成长敏捷，但产量仅占寰球的6%摆布。

Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths.

方法和化学沉积浴场，半导体芯片上使用四个优先铜铜电解池。

Side surfaces and the second main surface of the semiconductor chip made thin are sealed with resin.

以及用树脂密封被减薄的所述半导体芯片的侧表面和所述第二主表面。

But it is too slowly to the inspection of the semiconductor chip on line and other applications because of the single point scanning.

但象对半导体在线检测等应用领域，单点扫描方法测量速度慢，限制了其应用。

Semiconductor Chip trading company, such as Memory IC, Flash Memory. . . etc.

半导体晶片的买卖业，如记忆晶片，快闪记忆体等。

A semiconductor integrated circuit device comprising: a semiconductor chip having a plurality of surface electrodes;

本发明提供一种半导体集成电路器件，其包括：半导体芯片，具有多个表面电极；

second resin material installed sealed to the semiconductor chip on top of the circuit board;

第二树脂材料，密封安装到电路板上方的半导体芯片；

first reflector formed on the circuit board surface on the semiconductor chip side and reflecting preset test light;

第一反射器，形成于半导体芯片侧上的电路板的表面上并反射预定的测试光；

first resin material filled in the gap between circuit board and semiconductor chip;

第一树脂材料，填充到电路板和半导体芯片之间的间隙中；

Attracting semiconductor chip manufacturers to set up fabrication plants in Hong Kong

吸引半导体晶片制造商在香港设立制造厂事宜